DOWSIL EA7100
Harmonization Code : 8001.20 | Unwrought tin: Tin alloys
Main features
- 15-Minute Cure at 100 deg C
- More Than 24-Hour Pre-Cure Window
- Aluminum and PBT Adhesion Data
Product Description
DOWSIL EA-7100 Adhesive is a one-part, non-flowing heat-cure silicone adhesive for bonding plastics, metals and cured silicones in electronics assemblies. Its 360,000 cP viscosity and 5.8 thixotropy support bead retention during manual or automated needle dispensing. The material provides a 60-minute open time after dispensing at 25 deg C, more than 24 hours of assembled pre-cure time and a recommended 15-minute cure at a 100 deg C bondline. The cured adhesive has 260% elongation, 2.4 MPa aluminum lap shear, 2.6 MPa PBT lap shear and 17 kV/mm dielectric strength. Secondary moisture cure removes residual surface tack after heat cure.
Key features
- 15-minute heat cure: Recommended cure is 15 minutes at a 100 deg C bondline.
- Extended pre-cure assembly window: Open time is 60 minutes and assembled pre-cure time exceeds 24 hours at 25 deg C.
- Multi-substrate adhesion data: Typical lap-shear values are 2.4 MPa on aluminum and 2.6 MPa on PBT.
Applications
Automotive electronics control units, sensors, lighting or display modules, lid sealing, base-plate attachment, gasketing and connector sealing.
TDS, SDS & Technical Documents
Technical Specifications
Mechanical Properties
Electrical Properties
Physical Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied and processing-window values. Cure time is based on bondline temperature. Values are not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component count | One | As supplied | |
| Product form | Non-flowing adhesive | As supplied | |
| Viscosity | 360000 | cP | As supplied |
| Thixotropy | 5.8 | As supplied | |
| Open time after dispense | 60 | minutes | At 25 deg C |
| Assembled pre-cure time | > 24 | hours | At 25 deg C |
| Recommended heat cure | 15 | minutes | At 100 deg C bondline |
After-processing / final-state properties
Typical cured properties; most values are based on the recommended cure profile. Adhesion data are substrate-specific. Values are not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Specific gravity | 1.09 | Cured | |
| Tensile strength | 3.4 | MPa | Recommended cure profile |
| Elongation | 260 | % | Recommended cure profile |
| Durometer hardness | 43 | Shore A | Recommended cure profile |
| Tensile modulus | 1.1 | MPa | Recommended cure profile |
| Lap shear to aluminum | 2.4 | MPa | Substrate-specific |
| 180-degree peel to aluminum | 27.5 | N/cm | Substrate-specific |
| Lap shear to PBT | 2.6 | MPa | Substrate-specific |
| Linear CTE | 247 | ppm/deg C | Cured material |
| Volume resistivity | 9E+14 | ohm cm | Cured material |
| Dielectric strength | 17 | kV/mm | Cured material |
| Dielectric constant | 2.91 | At 100 kHz | |
| Dissipation factor | 0.004 | At 100 kHz |
