3M AF163-2L.0303M

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

3M AF163-2L.0303M

Main features

  • Lightweight Nonwoven Carrier
  • Defined Thin Film Construction
  • Low Pressure Cure Capability

Product Description

3M Scotch-Weld Structural Adhesive Film AF 163-2L, 0.030 wt is a pink, modified epoxy structural adhesive film with a lightweight matte nonwoven carrier. The 0.030 lb/ft2 construction provides a nominal 5.5 mil thickness for bonding prepared metal, composite, and honeycomb assemblies. The supported film assists layup and bondline placement before heat cure. AF 163-2 family processing supports low-pressure and vacuum cure methods, with a 90 minute cure available at 225 deg F. Surface preparation, primer, pressure, and cure cycle define the complete bonding process.

Key features

  • Lightweight Nonwoven Carrier: The L construction supports handling and placement during layup.
  • Defined Thin Film Weight: The 0.030 lb/ft2 film has a nominal 5.5 mil thickness.
  • Low Pressure Cure Capability: The AF 163-2 family supports low-pressure and vacuum cure processing.

Applications

Structural bonding of prepared aerospace metals, composites, and honeycomb sandwich assemblies.

Product Family

3M AF163-2L.0303M

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

No specifications available.

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
CarrierLightweight matte nonwoven-L construction
Nominal areal weight0.030lb/ft2AF 163-2L
ColorPink-As supplied
Nominal thickness5.5milAF 163-2L, 0.030 wt

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